Chem-Wik® Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik® Rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less “contact" pressure for greater operator control. All sizes are coated with a Type “R" organic flux system.
- Requires little or no post solder cleaning
- No corrosive residues
- Optimized weave design for faster wicking and heat transfer
- Halide free
- Minimal risk of heat damage to components and circuit boards
Chem-Wik® Rosin desoldering braid safely removes solder from:
- Thru-hole Components
- Surface Mount Device Pads
- BGA Pads
- Micro Circuits
- Terminals
- Lugs and Posts
- Identification Script